English　｜　中文版
RDL Technology TSV Application PCBA Patent         category select serch sel select a.*, b.PT_Name from (p_type a left join p_type1 b on a.PT_Id = b.PT_Id) order by b.Sort asc, b.PT_Id asc, a.Sort asc, a.T_Id descSmart Card QFN 0 MB USB LED SSD Pen Drive G Sensor Light Sensor Controller (Small die size) Flash DDR2 (High Frequency) Other CMOS Sensor Light Sensor Flash Stack Die key word	Home > Technology > TSV Application > Product application with TSV package         Product application with TSV package 2009-11-19   Light sensor   CIS image sensor
No.145, Sec.2,Chung Yuen Rd.,Lung Tan Hsiang Taoyuan,Taiwan 325,R.O.C. TEL:+886-3-411-7922 FAX:+886-3-411-7926   Copyright © 2009 AMB Technology CO., Ltd.. All rights reserved.

Web design by Yummy