 |
| |
| |
CSP, RDL, BUMPING low cost package |
|
|
 |
| |
 |
Cost effective to traditional package. |
|
Better electrical performance. |
|
|
Package downsize , more slim, and higher
density |
|
|
High production throughput, and short
lead-time. |
|
RDL with pitch 20/20um Line/Space |
|
Wafer Solder Bumping 250um pitch |
|
RDL with pitch 20/20um Line/Space |
|
Wafer Solder Bumping 250um pitch |
|
|
|
| |
| |
3D ICs & Multi-ICs Stacking Package |
|
|
|
| |
|
High density stacking with SMT process.
|
|
|
Wide product application (light sensor, image sensor, multi-chip module, ....) |
|
|
MCP, SIP, Multi-ICs Stacking Package
CMOS Image Sensor , Light Sensor, LED,
Logic IC, MEMS, RFIC, BaseBand IC, ...
Dual Side RDL by TSV & 3D Stacking
technolgy . |
| |
|
|
|
|
| |
Finish Product ODM business |
|
|
| |
|
UFD, SSD,..... PCBA biz
|
|
|
microSD, SD, UFD module , Long-DIMM,
SO-DIMM |
 |
|
|
|
 |
