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Home > About us > Core competitiveness |
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| Core competitiveness (100% owned IP) |
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Low Cost Package in Chip Size |
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Cost effective to traditional package |
| Package downsize , more slim, and higher density. |
| Better electrical performance. |
| High production throughput, and short lead-time. |
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Redistribution Layer and Bumping Service |
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RDL with pitch 20/20um Line/Space |
| Wafer Solder Bumping 250um pitch |
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Module Solution |
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Integaration/customer desinged RDL + PCB |
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Cost effective, wafer-in/Module-out |
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